JUN YOUNG KIM

Electrical_Engineering_Student

EXPERIENCE

Seneca

SENECA

seneca.com ↗

Electrical Engineering Intern

Sausalito, CA  ·  January 2026 – May 2026

  • Spearheaded design to flight validation of a proprietary perception PCB across 3 revisions and re-architectures, delivering DroneCAN, GPIO, and Gigabit Ethernet switching (10/100/1000BASE-T) between the central compute and 8+ perception peripherals spanning LiDAR to avionics, while supplying 300W+ of eFuse-protected power across the subsystem for next-generation firefighting aircraft
  • Drove bring-up of perception hardware stacks across 5 next-generation drones, multiple calibration rigs, and an electrical mule, validating power delivery and networking, fabricating LiDAR, Ethernet, and power harnesses, and field-debugging on-site for flight readiness and customer deployment
  • Designed a wide-input DC-DC power conversion board stepping a 28S battery pack (84–117.6V) down to four regulated rails (24V/12V/5V/3V3) at 150W+, powering the complete perception compute and sensor stack validated across multiple R&D drones
Solderable

SOLDERABLE.DEV

solderable.dev ↗

Electrical Engineering Contract

San Francisco, CA  ·  September 2025 – December 2025

  • Designed an RP2040-based DAC/amp mod board with BQ25185 PMIC and custom audio output stage within a 24mm × 50mm form factor for VR headset audio modification, shipping 300+ production units
  • Designed a miniaturized BLE camera wearable integrating nRF52840, HM01B0 camera, and MAX77650 PMIC within a 22mm × 11.5mm board fitted inside a Sony WF-1000XM5 earbud shell
  • Designed a Bluetooth e-ink audio media controller (ESP32-S3 + BM83) with dual 3.7" e-ink FPC displays, BQ24074/TPS63070 power management, microSD, accelerometer, and ALS on an 80 × 45mm board
Electrans

ELECTRANS TECHNOLOGIES LTD.

electranstech.com ↗

Electrical Engineering Intern

Oakville, ON  ·  May 2025 – August 2025

  • Designed a CAN-controlled 4-layer actuation PCB for trailer accessories with 16 independent 10A half-bridge outputs, 100-pin NXP MCU, load-current sensing, and 24V transient/reverse protection, integrating 250+ components to deliver 45A total input and meet automotive reliability standards
  • Developed, and simulated in LTspice, a modular Bed-of-Nails pogo test PCB for USB-powered, QA of CAN-receiver boards (panel-test 10 units, R-Pi monitoring), enabling QA throughput by 50% through short detection and CAN termination verification within 1%
  • Redesigned CAN-bridge PCB architecture for the trailer Auto Connect plug to safely link vehicle J1939 CAN to trailer CAN, optimizing schematic, PCB layout, and component selection for 70% faster assembly for 5000+ units and reducing test failure rate from 20% to 0%
  • Established a QA station for Auto Connect plug harnesses, using an MCU with 50+ GPIO connections and custom C++ continuity verification firmware to provide real-time LED validation of wiring integrity
  • Optimized PnP setup, standardized testing procedures, and reorganized Altium workspace, severely reducing production failures and establishing company-wide organizational standards
Midnight Sun

MIDNIGHT SUN SOLAR CAR TEAM

uwmidsun.com ↗

EE Intern & Leadership Member

Waterloo, ON  ·  August 2024 – April 2025

  • Redeveloped the Battery Management System PCB for the solar-powered car's 150V battery loop with integrated precharge protection, electrical isolation, improved OCP features, and subsystem communication via SPI, I2C, isoSPI, and CAN
  • Improved solar car's wiring harness with proper wire gauges, continuity verification, and structured cable management and crimping techniques to enhance electrical reliability
  • Assembled and validated PCBs with SMD soldering, DMMs, oscilloscopes, load testers, and function generators, for in-circuit testing to ensure circuit functionality
  • Directed a team in designing an infotainment driver dashboard PCB by leading stand-ups and overseeing schematic bring-up, Altium workflows, and member training